1. Silicon, which is the most important integrated circuit material at present, and most ICs are made of this material;

2. Germanium silicon, one of the most popular compound materials, is widely used in GHz mixed signal circuits;

3. GaAs, the most widely used second-generation semiconductor, is mainly used in the RF field, including RF controller devices and RF power devices;

4. SiC and InP, the so-called third generation semiconductors, the former in the field of RF power and the latter in the field of ultra-high speed digital, belong to the next generation of semiconductor materials.

    The working principle of the chip is: the circuit is manufactured on the surface of the semiconductor chip for operation and processing.

    Integrated circuits have two main advantages over discrete transistors: cost and performance. The low cost is because the chip prints all components as a unit through photolithography technology, rather than making only one transistor at a time.

    Integrated circuit chip is an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic base to make a chip. IC chip includes wafer chip and packaging chip. The corresponding IC chip production line is      composed of wafer production line and packaging production line.

     The transistors in the chip are divided into two states: on and off. They are usually represented by 1 and 0, and then transmit signals and data through 1 and 0. After the chip is powered on, it will generate a start command, and all transistors will begin to transmit data and output specific commands and data.

     The integration degree of IC chip refers to the number of components contained on a single chip. The higher the degree of integration, the more components are accommodated.

     The linewidth of integrated circuits can usually be understood as the minimum line width in the processed circuit graphics, but in MOS circuits, people often define the linewidth according to the gate length. There is a corresponding relationship between integration and linewidth, that is, the higher the integration, the smaller the linewidth. Therefore, linewidth is also commonly used to represent the level of integrated circuit manufacturing technology.

    With the development of large-scale integrated circuits and very large-scale integrated circuits, people have higher and higher requirements for lithography resolution. 0.35 in 1995 μ m. 0.18 in 1998 μ m. Now the direction of efforts is 0.18 μ m. Then 0.13 μ m。 Obviously, the original lithography process can not meet the requirements. Therefore, many improvements have been made to the traditional lithography methods to meet the requirements of resolution and increase the integration of integrated circuits.

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